InChem Corporation

Our Services

» Introduction To Phenoxy Resins
» Products List
» Phenoxy Standard Solid Grades
» Standard Solvent Solution Grades
» Waterborne Colloidal Dispersions
» Phenoxy/Polyester Hybrids
» Liquid Epoxy/Phenoxy Hybrids
» Caprolactone-Modified Phenoxy
» Epoxy Resin Solutions & Crosslinkers
» InChem Corp. Main Website
» Site Map
» Online Contact Form
» Call us at 800-331-7721
adhesive applications
Selection Guidelines

InChem Phenoxy Resins can be used as the sole resin vehicle in adhesives formulations. 

For crosslinked systems using the pendant secondary hydroxyls on the Phenoxy backbone, it is recommended to empirically determine the best level of crosslinker for a balance of coatings properties such as hardness and flexibility. Usually the level of crosslinker or hardener is about 10 to 15 phr (parts per hundred) on a solids basis.

Typical crosslinkers used in thermoset applications are melamine-formaldehyde resins, phenolics, blocked isocyanates, and polycarboxylic acids. InChem now provides a phenolic crosslinker called InChem Resin PR-65 useful for thermoset coatings and adhesives based on hydroxyl functional vehicles like solid grade epoxies, OH-functional polyesters, and Phenoxy resins.

In hot melt applications with thermoplastic urethanes (TPU’s) and copolyethylene vinyl acetate resins (EVA’s), Phenoxy resins can be incorporated at levels as low as 10% to act as antiplastizers imparting properties such as stiffness and cohesive strength.

For modifying epoxy systems, the powder grades of Phenoxy are easy to incorporate. Alternatively, the liquid and solid blends offered by InChem provide a “user friendly” avenue.  Phenoxy behaves as  a “hard plasticizer” in many epoxy matrices used as adhesives by interpenetration. In acid cured and anhydride-cured systems Phenoxy may partially tie into the cured matrix.

Adhesives composites
Applications Guide-Adhesives

In Adhesives Applications, InChem Phenoxy Resins offer a wide selection for your chosen technology. Phenoxy Resins are used to add superior adhesion promotion to a wide variety of substrates. The large number of secondary hydroxyls give Phenoxy the “bite” that many systems require. The linear thermoplastic nature of Phenoxy provides flexibility to rigid crosslinked systems. Phenoxy resins find use in aerospace and automotive latent cure and hotmelt adhesives by improving adhesion and flexibility of epoxy-based compounds, and circuit board laminating adhesives by increasing bond strength to the boards. Applications include:

• Solventborne
• Waterborne - Air dry and thermoset
• Hot melt
• High solids - Thermoset and Air-dry 2K

Learn more in the table below and in the guidelines at right:

Applications Guide: Adhesives Chemistry & Technology

Chemistry
Solventborne
Waterborne
Powder
High Solids
Epoxy/Amine
2K Ambient
 


Epoxy/X-Linker
1K Latent
 
Polyester/NCO
2K Ambient
   
Polyester/NCO
1K Blocked
Melamine
Thermoset
 
Phenolic
thermoset
 
Epoxy
Cationic
   
EVA
hotmelt
   
TPU
hotmelt
   
Copyright InChem Corporation. All Rights Reserved. 800-331-7721
Website Design By Lawrimore Inc.