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Adhesives Selection Guide

InChemRez® Phenoxy resins can be used as the sole resin vehicle in adhesives formulations.  For crosslinked systems using the pendant secondary hydroxyls on the Phenoxy backbone it is recommended to empirically determine the best level of crosslinker for a balance of coatings properties such as hardness and flexibility. Usually the level of crosslinker or hardener is about 10 to 15 phr (parts per hundred) on a solids basis. Typical crosslinkers used in thermoset applications are melamine-formaldehyde resins, phenolics, blocked isocyanates, and polycarboxylic acids. InChem now provides a phenolic crosslinker called InChemRez® PR-65 useful for thermoset coatings and adhesives based on hydroxyl functional vehicles like solid grade epoxies, OH-functional polyesters, and Phenoxy resins.

In hot melt applications with thermoplastic urethanes (TPU’s) and copolyethylene vinyl acetate resins (EVA’s) Phenoxy resins can be incorporated at levels as low as 10% to act as antiplastizers imparting properties such as stiffness and cohesive strength.

For modifying epoxy systems, the powder grades of Phenoxy are easy to incorporate. Alternatively, the liquid and solid blends offered by InChem provide a “user friendly” avenue.  Phenoxy behaves as  a “hard plasticizer” in many epoxy matrices used as adhesives by interpenetration. In acid cured and anhydride-cured systems Phenoxy may partially tie into the cured matrix.

In Adhesives Applications InChemRez® Phenoxy and UV based resins offer a wide selection for your chosen technology.

Phenoxy resins are used to add superior adhesion promotion to a wide variety of substrates. The large number of secondary hydroxyls give Phenoxy the “bite” that many systems require. The linear thermoplastic nature of Phenoxy provides flexibility to rigid crosslinked systems

Phenoxy resins find use in aerospace and automotive latent cure and hotmelt adhesives by improving adhesion and flexibility of epoxy-based compounds, and circuit board laminating adhesives by increasing bond strength to the boards

• Solventborne
• Waterborne
• air dry
• thermoset
• Hot melt
• High Solids
• thermoset
• air-dry 2K
• UV/EB